| 주 저자 | Minseong Kim, Junseok Park, Jae-Weon Jeong |
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| 공동 저자 | - |
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| 소속 | - |
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| Abstract | This study presents an experimental evaluation of a thermoelectric active insulation panel proposed as a proof-of-concept building-envelope component for boundary-matched thermal control. Prototypes comprising a 5 × 5 array of thermoelectric modules bonded to aluminum or copper plates were evaluated in a controlled climate chamber at temperature differences (ΔT) of 1 to 15 °C. Electrical power consumption increased nonlinearly with ΔT, with relatively low electrical demand observed below approximately 9 °C under the tested conditions. This range represents a potential operating region for further energy-performance assessment rather than a verified net energy-saving regime. The aluminum prototype consumed more power at lower ΔT, whereas the copper prototype consumed more at higher ΔT, with a crossover near 8 °C; the underlying mechanisms require further verification. Fifth-order polynomial regressions reproduced the measured power consumption with R2 values of approximately 0.999 and root mean square errors of 1.36 and 1.43 W/m2 for the aluminum and copper prototypes, respectively. The results provide electrical-input characteristics and empirical correlations within the tested configuration and boundary conditions. Direct heat-flux measurements, wall-assembly energy-balance assessment, and closed-loop control validation are required before confirming thermal benefits and whole-building energy savings. |
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| Keyword | Thermoelectric technology, Active insulation, Dynamic thermal resistance, Boundary matching, Empirical model |
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| 페이지 | pp. 1~18 |
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| 논문 파일 |
없음
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| 게재일시 |
2026-11
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| DOI | https://doi.org/10.1016/j.csite.2026.108588 |
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| 학회/저널명 | Case Studies in Thermal Engineering Vol.87, No.108588 |
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| 년도 | 2026 |
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| 추가 문구 | https://doi.org/10.1016/j.csite.2026.108588 |
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| 등록 일시 | 2025-11-18 15:56:56 |
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